Industry Experience
Millennium Design works with clients in a variety of markets, across numerous industries. Because we stay current with emerging technologies and industry trends, we’re often called upon to work on complex, high-tech projects where cross-industry knowledge is essential in both the development strategy and end-product reliability.
Our work process factors in both relevant market considerations and certification requirements, which ensures the appropriate path is not only well-known, but fully planned for. From MIL Spec to Telco standards, FDA, UL, FCC, and even volume manufacturing / test strategies; our short-term due diligence results in long-term client savings.
- Consumer Products
- Wireless
- Networking & Communications
- Medical
- Military & Aerospace
- Data Storage
- Semiconductor & Test
- Computing
- Green Energy
- Industrial / Instrumentation
Below are a few recent projects organized by Market and applicable Engineering support:
Consumer Product
Hand Held Electronic Device
PCB Design, Fab & Assembly
- Size - 1.9” X .6”
- 10 Layers
- Multiple uBGA’s - .5mm
- Stack micro and blind vias
- In production at 300K annual usage
Rescue Locator Device
Electrical, Software and Mechanical Design, PCB Design and Manufacturing
- Size – 2” X 2”
- 04 Layers
- Battery powered, small form factor device with GPS and Cellular technology.
- Full Product Development
Robotic All Floor Vacuum Cleaner
Power Integrity, EMI Certification, PCB Design
- Size – 5.8” X 3.7”
- 06 Layers
- Heavy mix of analog and digital circuits in dense form factor.
- Re-worked original power circuits for successful EMI certification.
Wireless
WiMAX Multimode 4G dongle
Electrical Design, Mechanical Design, PCB Design and Manufacturing
- Size – 4.2” X 1.4”
- 6 Layers
- Stacked Micro and Blind Via’s
- Detailed RF Analysis
- Full Product Development
Green Energy
System Controller for Smart Lighting
PCB Design
- Size – 16.0” X 3.9”
- 10 Layers
- Marvell, Altera
- DDR2, SRAM, Ethernet, SATAs
Computing
AMD Athlon X86 Computer
Electrical Design, Signal Integrity, PCB Design and Manufacturing
- Size – 4” X 3.6 X 3.6”
- 3 separate boards utilizing custom board to board connectors
- DDR2, Hypertransport, PCIe,
Medical
Robotic Surgical Device
PCB Design
- Size - 4.1” X 3.2”
- 12 Layers
- Xilinx FBGA, Firewire, Ethernet, Fiber Via in Pad
- Buried capacitance
Industrial
Router Board
PCB Design
- Size - 10” X 14”
- 22 Layers
- Xilinx FBGA, Broadcom, AMCC
- XAUI, PCIe, DDR2, DDR3
- SFP, XFP, SerDes
Semiconductor
FPGA Emulation Board
PCB Design and Manufacturing
- Size – 16” X 20”
- 24 Layers
- Seven Xilinx Vertex 5 FPGA’s FF1760
- DDR2, USB, PCIe,
Wireless
Semiconductor Reference Design
Electrical Design and PCB Design
- Size – 7” X 7”
- 10 Layers
- Stacked Micro Vias, Blind Vias
- WiFi, Customer Power Design
Industrial Computing
ATCA Formfactor
PCB Design
- Size – 11.0” X 12.6”
- 18 Layers
- Multiple Xilinx FPGA’s
- XAUI, DDR2
- Proprietary busses at 8 GT/s
- Differential at 3.125 MHz
Wireless
Consumer Premise Equipment
Electrical Design, PCB Design & Manufacturing
- Size – 2” X 2”
- 06 Layers
- Stacked Micro and Blind Vias
- Ethernet, VOIP
Networking
Server for Data Centers
PCB Design
- Size – 17” X 18”
- 24 layers
- Dual next generation Intel processors
- QPI front side bus at 6.4GT/S
- PCIe Gen II
- 48 DDR3 DIMM’s
- Numerous signal integrity cycles to solve for physical limitations
- Extensive work went into pin out optimization for on several custom ASIC’s
- 37 unique switching power supplies
Data Storage
NVRAM SATA card
PCB Design
- Size – 9.0” X 4.3”
- 14 Layers
- Cavium Network Adapter Processor
- Altera FBGA
- PCIe @ 6GHz, DDR3, 10 Gigabit Ethernet
Green Energy
Inverter Controller for Solar Panel
PCB Design
- Size – 22.0” X 15.9”
- 08 Layers
- Heavy mix of analog, digital and electro mechanical circuits. DSP Controller.
Networking
Server for Data Centers
PCB Design
- Size – 9” X 21
- 24 layers
- Dual next generation Intel processors
- QPI front side bus at 6.4GT/S
- PCIe Gen II
- 24 DDR3 surface mount DIMM’s
- Stacked Micro Vias
- Blind Vias
- Buried Vias
- 7 lamination cycles
- Built in production
Wireless Computing
Law Enforcement Application
PCB Design
- Size – 7.1” X 4.2”
- 14 layers
- Intel Atom Processor
- Micro and Blind Vias
- PCIe, DDR2, USB, WiFi
- Video LVDS
Test
Reliability Characterization
Electrical and Mechanical Design, PCB Design & Manufacturing
- Device
- Size – 15” X 23”
- 08 Layers
- Full Product Development
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