PCB Design


Millennium Design offers clients a PCB Design service that incorporates both state-of-the-art tools and experienced senior-level engineering talent. This allows us to deliver you a superior product that satisfies your exact requirements – every single time.

Our team is comfortable and skilled working on complex, multifaceted design efforts.  More importantly, our designers have the ability to innovate working solutions by effectively collaborating with engineers on all levels, including electrical, signal integrity, power integrity, mechanical/thermal and manufacturing/operations. We understand the physics of transmission lines and how to apply them to practical layout solutions.

The industries we have experience designing Printed Circuit Boards for are as diverse as the boards themselves: networking & communications, consumer products, medical, wireless, military, data and storage systems, green energy, aerospace, semiconductor development, and many more. With over 2,000 completed board design’s to date, you can trust that we will meet (and exceed) your expectations.

In addition, if needed, we also combine our PCB design services as part of a larger array of services if a full turnkey solution is desired – covering all engineering related disciplines and manufacturing services , we’re ready to put the best minds in the business to work for you.

We offer the following layout services to our customers….
Simple through complex PCB design solutions
High speed design experts
Analog and RF and Power Supply design
Custom footprint, pad stack and library creation following IPC 7351
Constraint driven rule management
FPGA & Asic Pin-out optimization & route study
Stack up verification
Signal Integrity and EMI compliance certification
Bullet proof design process built around structured reviews and client communication
Expert project management from concept through manufacturing
Design for Manufacturability performed using Valor Enterprise 3000
Experience with the following technologies….
High speed frequencies to 10Gbps
Mixed Technology – Flex, Analog, RF, Power, Mesh
High Density Interconnect - Blind & Buried Via / Micro Via / Via in Pad
DDR3 / DDR2 / DDR / Rambus / SDRAM / QDR
PCIe / PCIX / PCI / HyperTransport / QPI / Rocket IO / XAUI / SERDES / SPI-4 / AGP
USB / Firewire / Spacewire / Serial ATA
1GbE and 10GbE / InfiniBand
HDMI / DVI / Composite Video / S Video / VGA
4G LT WiMax / 802.11a, b & g / Bluetooth / GPS
Highest layer count - 44 layers
Highest Pin Count - 60,564 pins
Largest BGA - 1mm pitch – 2,700 pins
Smallest BGA - .4mm full matrix
Most Complex HDI – 26 layer, 7 lamination cycles, blind-buried-micro-stacked vias
     Tool Sets

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