
Millennium Design offers clients a PCB Design service that incorporates both state-of-the-art tools and experienced senior-level engineering talent. This allows us to deliver you a superior product that satisfies your exact requirements – every single time.We offer the following layout services to our customers….
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| Simple through complex PCB design solutions | |
| High speed design experts | |
| Analog and RF and Power Supply design | |
| Custom footprint, pad stack and library creation following IPC 7351 | |
| Constraint driven rule management | |
| FPGA & Asic Pin-out optimization & route study | |
| Stack up verification | |
| Signal Integrity and EMI compliance certification | |
| Bullet proof design process built around structured reviews and client communication | |
| Expert project management from concept through manufacturing | |
| Design for Manufacturability performed using Valor Enterprise 3000 | |
Experience with the following technologies….
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| High speed frequencies to 10Gbps | |
| Mixed Technology – Flex, Analog, RF, Power, Mesh | |
| High Density Interconnect - Blind & Buried Via / Micro Via / Via in Pad | |
| DDR3 / DDR2 / DDR / Rambus / SDRAM / QDR | |
| PCIe / PCIX / PCI / HyperTransport / QPI / Rocket IO / XAUI / SERDES / SPI-4 / AGP | |
| USB / Firewire / Spacewire / Serial ATA | |
| 1GbE and 10GbE / InfiniBand | |
| HDMI / DVI / Composite Video / S Video / VGA | |
| 4G LT WiMax / 802.11a, b & g / Bluetooth / GPS | |
| Highest layer count - 44 layers | |
| Highest Pin Count - 60,564 pins | |
| Largest BGA - 1mm pitch – 2,700 pins | |
| Smallest BGA - .4mm full matrix | |
| Most Complex HDI – 26 layer, 7 lamination cycles, blind-buried-micro-stacked vias | |